~ Process Equipment - (FEOL/BEOL/TGV/AUTO) ~

① Multi-size Single Wafer
*ION-12
• Higher throughput : 12 cleaning tanks, 520 wafers/hour
• Minimal cleaning tank design
• Smaller footprint (10.4 sq m)
• Independent exhaust control
• Front-end line (FEOL) or back-end line (BEOL) cleaning
• Post-etch cleaning (DSP stripping)
• Pre/post-cleaning [Hydrofluoride (DHF), SC1, O₃HF, HIPA, etc.]

✽ APOLLON
• Single wafer cleaning 8 cleaning modules
• Throughput : 300 WPH, 8 tanks
• Field-proven performance (19 nm)
• Reduced chemical consumption (chemical recovery rate : 98%)
• Front-end line (FEOL) or back-end line (BEOL)
• Cleaning
• Post-cleaning (SC1, DHF, etc.)

✽ (ATOM)
• 400mm Ring Wafer Cleaner - HBM Cleaning, 2.5D
• 400mm Ring Wafer Cleaner
• Supports warped wafers (≤ 3 mm)
• Cleaning using HBM and 2.5D processes
• Debonding cleaning
• UBM etching (copper, titanium)
• Post-sawing cleaning


② Rapid Thermal Processing System (RTP for Si, SiC, GaN)
✽ RHP200
• Silicon (Optional: 6-inch or 8-inch conversion)
• Silicon Carbide (Optional: 6-inch or 8-inch conversion)
• Double-sided wafer heating to minimize wafer stress
• Side gas ejectors efficiently remove oxygen to concentrations as low as 1ppm
• Wafer rotation for improved temperature uniformity
• Three pyrometers for precise temperature control

✽ RHP200XL
• SiC (Optional: 6-inch or 8-inch conversion)
• Silicon carbide (optional: 6-inch or 8-inch conversion)
• Improved temperature uniformity, especially suitable for RTO processes or post-injection annealing
• RTO/Rs non-uniformity: RTO 0.53%, Rs 0.29%, 1σ
• Patented flat-pattern lamp array for optimal temperature control
• Specially designed bulbs for improved thermal efficiency


✽ Ceramic heater – high speed heating & High speed cooling


✽ Floor LDT(Sales)


✽ Auto Equipment (EFEM/AGV/ROBOT)