Ring-type wafer cleaning machine (ATOM) • 400mm

✽ (ATOM) • 400mm Ring Wafer Cleaner - HBM Cleaning, 2.5D

• Supports warped wafers (≤ 3 mm)
• Cleaning using HBM and 2.5D processes
• Debonding cleaning
• UBM etching (copper, titanium)
• Post-sawing cleaning